PICMG Single Board

PROCESSOR
Dual-Core Intel® Xeon® Processor LV 1.66GHz to 2.0GHz*
Processor Package: Micro-FCPGA (478-pin)
*Higher speeds as available

CHIPSET
The CESDCX uses the Intel® E7520 chipset which operates on the 667Mz system bus and features a dual channel DDR2-400 memory interface. Three x8 PCI Express interfaces are supported by the CESDCX’s chipset. See the PCI Express Interfaces section for details on how the CESDCX implements PCI Express. The Intel® E6300ESB I/O Controller Hub supports the CESDCX’s dual Serial ATA/150 ports, four USB 2.0 interfaces, dual Ultra ATA/100 interfaces and the video and Ethernet controllers. The I/O Controller Hub’s LPC interface is routed to the board’s controlled impedance connector and supports an optional I/O expansion board (Core’s CE-00030) for legacy I/O and serial port communications. The optional CE-00031 expansion board supports legacy I/O via header connectors and provides an additional x4 PCI Express link to a PICMG 1.3 backplane. Communications between the Intel® E7520 Memory Controller Hub and the I/O Controller Hub occurs over a 266MB/s Hub Interface.

DUAL ETHERNET INTERFACES - 10/100/1000BASE-T
The CESDCX’s Gigabit Ethernet Controller (Intel® 82546EB) connects to the I/O Controller Hub via a PCI-X 64-bit/66MHz interface to provide high-speed 10/100/1000Base-T Ethernet interfaces on LAN ports 1 and 2. RJ-45 connectors, located on the I/O bracket, provide the physical interface to the Ethernet network.

DUAL SERIAL ATA/150 PORTS
The primary and secondary Serial ATA (SATA) ports on the CESDCX boards comply with the SATA 1.0 specification and support two independent SATA storage devices such as hard disks and CD-RW devices. SATA technology provides lower pin counts, reduced signaling voltages, simplified cabling, CRC error detection and hot-plug support. SATA produces higher performance interfacing by providing data transfer rates up to 150MB per second on each port.

CACHE MEMORY (L2 AND L1)
The Dual-Core Intel® Xeon® Processor LV 2.0GHz has a level two (L2) cache memory that is an integrated on-die Advanced Transfer Cache memory and is 8-way set associative with ECC to run at the full processor core frequency. The L2 cache memory size of 2MB is shared by the two processor cores.

The Dual-Core Intel® Xeon® Processor LV 2.0GHz also features 32KB level one (L1) instruction and data caches.

DDR2-400 MEMORY
The four DIMM sockets on the SLI support a total memory capacity of 8GB and the DDR2 memory interface can operate as either a single-channel or dual-channel interface. The theoretical maximum memory bandwidth for single-channel operation is 3.2GB/s and 6.4GB/s for dual-channel mode. Each of the channels (A and B) terminates in two dual in-line memory module (DIMM) sockets. The System BIOS automatically detects memory type, size and speed. The memory modules used on the SLI must be PC2-3200 compliant. The SLI supports a DDR2-400 memory interface speed. Modules with a faster memory speed may be used; however, they will be automatically clocked down to the DDR2-400 memory interface speed by the System BIOS and the SHB’s memory interface components.

DDR2-400 MEMORY DIMM SLOT POPULATION
DDR2-400 memory modules are available as either single rank or dual rank DIMMs. A rank refers to the 72-bit unit of devices or DRAM chips that make up the PC2-3200 ECC registered 240-pin DDR2-400 DIMM. Single or dual rank memory modules must be placed in the CESDCX's DIMM sockets using prescribed population rules to ensure proper memory interface operation and performance.

POWER REQUIREMENTS
Typical Values - 100% Stressed via MS Windows HCT’s System Stress
CPU +5V +12V +3.3V
1.66GHz 3.00A 2.20A 3.25A
2.0GHz 3.00A 2.60A 3.25A
-12V @ <100mA

Typical Values - System Idling In Windows XP Desktop
CPU +5V +12V +3.3V
1.66GHz 3.00A 1.30A 3.00A
2.0GHz 3.00A 1.65A 3.00A
-12V @ <100mA
Tolerance for all voltages is +/- 5% and must be applied by the PICMG 1.3 backplane to edge connector C.

ULTRA XGA VIDEO INTERFACE
The CESDCX is equipped with the third generation ATI® RAGE™ MOBILITY™ M1 video controller. The M1 enables 2D/3D video acceleration and provides 8MB of integrated video memory. In 2D mode the video controller supports pixel resolutions up to 1600 x 1200, and in 3D mode the maximum resolution provided is 1280 x 1024. The maximum color depth supported at these extremes is 16.7 million colors. Software drivers are available for popular operating systems.

TEMPERATURE/ENVIRONMENT
Operating Temperature: -0° to 60° C.
Airflow Requirement: 350LFM continuous airflow when using the passive heat sink
Storage Temperature: -40° to 70° C.
Humidity: 5% to 90% non-condensing
The Dual-Core Intel® Xeon® LV 2.0GHz processor used on the CESDCX has a Thermal Design Power (TDP) rating of 31Watts. The processor’s low TDP rating enables the CESDCX's passive cooling solution.

MECHANICAL
PASSIVE COOLING The CESDCX has a board stack-up height of .76" (1.93cm) with the SHB's passive heat sink cooling solution. Airflow of at least 350LFM must always be present across the SHB's passive heat sink. The CESDCX's overall dimensions are 13.3" L (33.78cm) x 4.976" H (12.64cm) x .76" W (1.93cm).

ACTIVE COOLING The CESDCX's optional active cooling solution has a cooling fan mounted on each CPU's passive heat sink resulting in a board stack-up height of 2.3" (5.84cm). Order the CESDCX with active cooling when 350LFM or more of airflow is not available for the processor.

Note: The PICMG 1.3 board height specification is approximately .176" (4.47mm) taller than the PICMG 1.0 specification. However, relative PICMG 1.3 board height off the backplane is the same due to the shorter edge connectors of a PICMG 1.3 system host board and the shorter PCI Express connectors on a PICMG 1.3 backplane.

CESDCX

Dual Core Intel® Xeon® SHB

View Larger Image