spacer  
spacer PLEASE VISIT OUR NEW WEBSITE CORE-SYSTEMS.COM   spacer
Click To See Product Drop Down
 
product
 
CEDQCX
Dual Quad Core Intel® Xeon® SHB
 
FEATURES
• Quad-Core Intel® Xeon® Processor 1.6-3.0GHz and the Intel® 5000P chipset
• Four processor execution cores per CPU
• Advanced power management enables superior processor performance per watt and an active heat sink cooling solution
• Compatible with the SHB Express™ (PICMG® 1.3) specification
• Supports four channel DDR2-667 memory, 16GB maximum
• Dual Gigabit Ethernet, six Serial ATA/300 ports and dual USB 2.0 ports
• Supports PCI Express, PCI-X and PCI option cards


CHIPSET
Maximum CEDQCX and CEDQCX-EM performance in dual processor applications is achieved with the independent system bus feature of the Intel® 5000P chipset. The chipset also enables 16GB (CEDQCX/CESQCX) or 32GB (CEDQCX-EM/CESQCX-EM) system memory SHB configurations. Other chipset features include configurable server-class PCIe link configurations, a four-channel DDR2 FBDIMM interface and 1066/1333MHz system bus support.

 

THREE ETHERNET INTERFACES -10/100/1000BASE-T
The CEDQCX series of SHBs offers advanced Ethernet connectivity that supports two Gigabit Ethernet ports on the board’s I/O bracket.  RJ-45 connectors on the I/O bracket provide the mechanical interface to these Ethernet networks. A third Gigabit Ethernet interface is routed to edge connector C of the SHB for use on a PICMG 1.3 backplane.

 

SERIAL ATA/300 PORTS
The integrated Serial ATA (SATA) controller provides six SATA   ports with data transfer rates up to 300MB/s. Independent SATA drive operation and RAID 0, 1, 5 and 10 drive array configurations are supported on the CEDQCX series of SHBs. SATA Systems provides lower pin counts, reduced signaling voltages, simplified cabling, CRC error detection and hot-plug device support.

 

DDR2-667/533 FB-DIMM MEMORY
The DDR2-667/533 Fully-Buffered DIMM (FB-DIMM) interface is a four-channel interface originating at the Memory Controller hub with each channel terminating at four FB-DIMM module sockets on the CEDQCX and CESQCX SHBs.  The CEDQCX-EM and CESQCX-EM SHBs have eight FB-DIMM sockets.  The SHBs use ECC registered PC2-5300 or PC2-4200 FB-DIMMs.  The CEDQCX/CESQCX SHBs support a maximum memory capacity of 16GB, while the CEDQCX-EM/CESQCX-EM boards feature an extended memory capacity of 32GB. The peak memory interface bandwidth per channel is 8.0GB/s when using the PC2-5300 FB-DIMMs. 

 

SUPER XGA INTERFACE
Core CEDQCX-series SHBs are equipped with the ATI ® ES1000 video controller. The external memory chip used with the ES1000 provides 16MB of on-board video memory. The video controller supports pixel resolutions up to 1280 x 1024 (SXGA). Software drivers are available for popular operating systems.

 

TEMPERATURE/ENVIRONMENT
Operating Temperature:  -0° to 60° C. (2.13GHz LV CPUs)
Operating Temperature:  -0° to 45° C. (All other processors)
Storage Temperature:  -40° to 70° C.
Humidity: 5% to 90% non-condensing

 

MECHANICAL
In a typical backplane, the cooling solution used on the CEDQCX series of SHBs enables placement of option cards approximately 2.38” (60.45mm) away from the top component side of the SHB. The standard memory versions of the SHBs (CEDQCX and CESQCX) have overall dimensions of 13.330” (33.858cm)L x 4.976” (12.639cm)H. The relative PICMG 1.3 SHB height off the backplane is the same as PICMG 1.0SBC due to the shorter PCI Express backplane connectors.  The extended memory versions, models CEDQCX and CESQCX, have overall dimensions of 13.330” (33.858cm)L x 5.726” (14.544cm)H.


 

PCI EXPRESS™ INTERFACES
Core’s server-class CEDQCX series of SHBs provides two x8 and one x4 PCI Express links on a PICMG 1.3 server-class backplane.  Each of the x8 links can be bifurcated into two x4 PCIe links, and the single x4 PCIe link can be bifurcated into four x1 PCIe links. These links, along with eight PCIe reference clocks, are routed to SHB edge connectors A and B. Core’s optional IOB31 module, part number 6474-000, may be used to provide an additional x4 PCIe link to the backplane. The PCI Express links support PCI Express option cards and bridge chips that provide PCI/PCI-X option card functionality.  PCI Express auto-negotiation capability is supported on the CEDQCX series of SHBs and enables communications to x1, x4, x8 and x16 PCI Express cards as well as PCI/PCI-X cards via PCI Express-to-PCI/PCI-X bridge chips on a PICMG 1.3 backplane.

 

BIOS (FLASH)
CEDQCX-series boards use AMIBIOS8 ; the flash BIOS resides in the  SHB’s Firmware Hub (FWH).  AMIBIOS8 contains features such as:
• Support for flash devices for BIOS upgrading
• Integrated support for USB mass storage devices such as USB, CD-ROM, CD-RW, etc.
• Boot from network, USB mass storage devices, IDE or ATAPI
• Serial port console redirection to support headless operation (requires optional CE-00031)
• SATA/ATA/ATAPI support includes 48-bit LBA addressing to support SATA/ATA/IDE hard drive capacities over 137GB

 

ADDITIONAL PRODUCT FEATURES
I/O Features:
• Support for two EIDE UItra ATA/100 disk drives
• Optional IOB30 I/O plug-in expansion board includes:
-Enhanced bi-directional parallel interface -PS/2 mouse and keyboard interface (mini DIN connector)
-Floppy drive interface
-Two high-speed serial ports
• Optional IOB31 I/O plug-in expansion board includes all IOB30 functionality plus a x4 PCI Express link on the IOB31 edge connector.  The edge connector plugs into a PCIe Expansion Slot on a PICMG 1.3 backplane.

 

STANDARDS
PCI Express Base Specification 1.1
SHB Express System Host Board PCI Express Specification - PCI Industrial Computer Manufacturers Group (PICMG ) 1.3 
Dual USB Interfaces
(Rev. 2.0)
Six Serial ATA/300 Interfaces
Dual USB Ports (Rev. 2.0)
SXGA Interface
Dual Full-Speed 10/100/1000Base-T Ethernet Interfaces

 

AGENCY APPROVALS
UL60950, CAN/CSA C22.2 No. 60950-00, EN55022:1998 Class B,
EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995,
EN61000-4-5:1995, EN61000-4-6:1996,EN61000-4-11:1994

PLEASE VISIT OUR NEW WEBSITE

CORE-SYSTEMS.COM
 
© Copyright 2013 Core Systems, All Rights Reserved
PRODUCTS CORE ENGINEERING ABOUT CORE NEWS SUPPORT TESTIMONIALS CONTACT