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CEDQCXi
Dual Quad Core Intel® Xeon® SHB with Nehalem core architecture
 
FEATURES
• Quad-Core Intel® Xeon® Processor 2.53-2.0GHz and the Intel® 3420 chipset
• Four processor execution cores per CPU
• Advanced power management enables superior processor performance per watt and an active heat sink cooling solution
• Compatible with the SHB Express™ (PICMG® 1.3) specification
• Supports three channel DDR3-1333 memory, 24GB maximum
• Dual Gigabit Ethernet, six Serial ATA/300 ports and eight USB 2.0 ports
• Supports PCI Express, PCI-X and PCI option cards


FORM FACTOR
PICMG® 1.3 Form Factor - Automatically adapts to graphics or server-class backplane PCIe link configurations - one x16 and one x4/four x1 or two x8 and one x4/four x1 PCIe links

 

PROCESSORS
Two Quad-Core Intel® Xeon® Processors EC5549 (2.53GHz with Hyper-Threading, 8MB Cache)
Two Dual-Core Intel® Xeon® Processors EC5539 (2.27GHz without Hyper-Threading, 4MB)
Two Quad-Core Intel® Xeon® Processors EC5509 (2.0GHz without Hyper-Threading, 8MB)
Two Quad-Core Intel® Xeon® Processors LC5528 (2.13GHz with Hyper-Threading, 8MB)

 

Jasper Forest processors support Intel® VT-x2 and Intel® VT-d2

 

BIOS (FLASH)
AMI - Aptio® 4.x

 

CHIPSET
Intel® 3420 Platform Controller Hub (PCH)

 

MEMORY
192GB (max. theoretical) and 48GB max. using 8GB DDR3 Mini-DIMMs, six-channel DDR3 (DDR3-1333) interface with six Mini-DIMM sockets (3 per CPU)

 

PCI Express EDGE CARD INTERFACES
Standard PICMG 1.3 PCI Express Interfaces - Automatically adapts to graphics or server-class backplane PCIe link configurations - one x16 and one x4 or two x8 and one x4/ PCIe links.  The direct PCIe links from the board's processors (links A0, A1, A2 and A3) may operate as either PCIe Gen 1.1 or PCIe Gen 2.0 depending on the backplane design.  The x4 link from the board's PCH (link B0) is always a PCIe 1.1 link regardless of what is connected to this link and the option card that is used.  PCIe link (B0) from the board’s PCH has a x4 default configuration and can be made to bifurcate into four, x1 PCIe links with a factory modification to the CEDQCXi board.  Contact Core if you require this B0 link configuration change.  The optional x1 link available with a Core CE-00033 expansion module is a PCIe 1.1 link only.

 

Optional PCI Express Gen 2.0 Link Expansion - Installing a Core PEX10; PCI Express Expansion module, on the back of the CEDQCXi provides four additional x4 PCIe Gen 2 links to a PCIe backplane.  The backplane must have an edge connector slot to accommodate the PEX10's edge connector.  The backplane may use these additional x4 links independently or as one additional x16 PCIe Gen 2 link.

 

VIDEO INTERFACE
XGI® Volari™ Z11M Graphics Processing Unit, 8MB video memory supports screen resolutions up to 1920 x 1200 (WUXGA) with a 64K color depth

 

ETHERNET INTERFACES
Intel® 82575 Ethernet Controller - Two 10/100/1000Base-T on I/O Bracket Connectors
Intel® 82577LM  Ethernet PHY - One 10/100/1000Base-T interface routed to SHB edge connector "C"

 

ON-BOARD INTERFACES
Eight USB 2.0 ports - Two each on the I/O bracket and on-board headers plus four routed to SHB edge connector "C"

 

Six SATA II/300 interfaces with RAID 0,1,5 and 10 support

 

Optional CE-00033 provides the following I/O expansion capabilities:
 - CE-00033 I/O plate connectors - Two DB9 RS232 serial ports and one PS/2 MiniDin for PS/2 mouse & keyboard
 - CE-00033 header connectors - Floppy drive, parallel port, PS/2 keyboard and PS/2 mouse

 

BATTERY
Lithium - CMOS data retention

 

MECHANICAL
Board dimensions – 13.330” (33.86cm) L x 4.976” (12.64”cm) H 
Standard cooling solution height – 2.15” (54.61mm)

 

AGENCY APPROVALS & COMPLIANCE
Designed for UL69050, CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

 

OPERATING TEMPERATURE
0-50° C (with standard cooling solution and 350LFM of continuous airflow)

 

ENVIRONMENTAL
Storage -  -20° to 70° C.
Humidity - 5% to 90% non-condensing.

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